Review of Chip Manufacturing Process, FEOL and BEOL concepts
BEOL: Interconnect formation, importance of BEOL for delay and yield,
Process Integration
Lithography: Layout, mask, photo, basic steps in litho, stepper vs.
scanner, Depth of Focus, RET, OPC, PSM partial field chips
Deposition: PVD & CVD concepts, Electrochemical depositions, Electromigration
vs grain size, Atomic Layer Deposition
Material Removal: Wet and Dry etching, Aluminum and Oxide etching,
Chemical Mechanical Planarization, Dishing, Erosion, Issues in Shallow
Trench Isolation
FEOL: Review of electron band structure, MOSFET operation, FEOL integration
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Diffusion and Ion Implementation: Interstitial and Substituional diffusion,
Constant Source and Limited Source Diffusion, Dopant redistribution,
lateral diffusion, Ion implantation mechanism, Channeling, RTA
Testing and Yield: Parametric (Scribeline) and product testing, Analysis
of sort (bin) test, Parametric test structures, Memory Tests, Memory
Repair, IDDQ, QBD, Reliability, Defectivity, Poisson, Murphy, SEEDS
and gamma models, Concepts of Critical Area, redundancy, Analysis of
inline, scirbeline and test data
Tools and Techniques: AFM, STM, SEM, TEM, AES, ESCA (XPS),
SIMS, AAS, Ellipsometry, FIB, Interferometry, Pulse Technology, Four
point probe
- Teacher: Ramanathan S